Mechanical behavior of copper with a submicrocrystalline structure / Pyshmintsev IY,Valiev RZ,Aleksandrov IV,Khotinov VA,Kil'mametov AR,Popov AA // PHYSICS OF METALS AND METALLOGRAPHY. - 2001. - V. 92, l. 1. - P. 92-98.

ISSN/EISSN:

0031-918X / нет данных

Type:

Article

Abstract:

The effect of postdeformation short-term low-temperature annealings and small plastic deformation by tension below the temperatures of the onset of recrystallization on the mechanical properties and specific features of the deformation-induced strengthening of commercial copper with a submicrocrystalline (SMC) structure was studied. It was found that the SMC structure formed upon severe plastic deformation could be strongly strengthened by this deformation, It was shown that the changes in the intensity of the deformation-induced strengthening of the SMC copper was determined by the defect structure of the grain boundaries and of the bulk of grains. A decrease in the defect density due to controlled annealing or a small preliminary deformation at an elevated temperature resulted in an appreciable increase in the rate of the deformation-induced strengthening and, as a consequence, ensured the excellent properties of the SMC copper at room temperature. The data on the effect of the treatments performed on the mechanical properties suggest that a small plastic deformation of the SMC copper at a temperature that is somewhat lower than the temperature of the onset of recrystallization can be a promising method to improve the structure, retaining the fine grain.

Author keywords:

SEVERE PLASTIC-DEFORMATION

DOI:

нет данных

Web of Science ID:

ISI:000170626600014

Соавторы в МНС:

Другие поля

Поле	Значение
Month	JUL
Publisher	INTERPERIODICA
Address	PO BOX 1831, BIRMINGHAM, AL 35201-1831 USA
Language	English
Keywords-Plus	SEVERE PLASTIC-DEFORMATION
Research-Areas	Metallurgy \& Metallurgical Engineering
Web-of-Science-Categories	Metallurgy \& Metallurgical Engineering
ResearcherID-Numbers	Popov, Artemiy/G-3947-2016
ORCID-Numbers	Popov, Artemiy/0000-0001-6171-1701
Number-of-Cited-References	10
Usage-Count-Since-2013	11
Journal-ISO	Phys. Metals Metallogr.
Doc-Delivery-Number	466CK