Electrodeposition of copper on metal-filled composite support / Rudoi V. M.,Ostanina T. N.,Darintseva A. B.,Ostanin N. I.,Alikhanova I. A.,Demakov S. L.,Prokof'eva A. S. // RUSSIAN JOURNAL OF ELECTROCHEMISTRY. - 2010. - V. 46, l. 6. - P. 702-706.

ISSN/EISSN:

1023-1935 / нет данных

Type:

Article

Abstract:

When a metal is deposited onto low-conductive supports, the metal deposit propagates from the contact site over the electrode surface. In the work, a mathematic model of variation in the overvoltage in the course of galvanostatic growth of copper deposit is proposed. The model takes into account the kinetic parameters of electrodeposition and geometric characteristics of growing deposit, which were obtained by using independent measurements. The chronopotentiograms, which were calculated by the model, agree satisfactorily with the experimental data. This allows one to apply the model proposed for estimating the tangential growth rate by the kinetic parameters of electrodeposition and structural characteristics of deposit.

Author keywords:

electrocrystallization; metal-filled composite; copper deposit; mathematic model; galvanostatic conditions; kinetic parameters

DOI:

10.1134/S1023193510060157

Web of Science ID:

ISI:000279435100015

Соавторы в МНС:

Другие поля

Поле	Значение
Month	JUN
Publisher	MAIK NAUKA/INTERPERIODICA/SPRINGER
Address	233 SPRING ST, NEW YORK, NY 10013-1578 USA
Language	English
Research-Areas	Electrochemistry
Web-of-Science-Categories	Electrochemistry
Author-Email	VLMX@rambler.ru
Funding-Acknowledgement	Russian Foundation for Basic Research {[}08-03-99073]
Funding-Text	This work was supported by the Russian Foundation for Basic Research, project no. 08-03-99073.
Number-of-Cited-References	6
Usage-Count-Since-2013	7
Journal-ISO	Russ. J. Electrochem.
Doc-Delivery-Number	619MU