Water-Glass-Based Thermal Paste for High-Temperature Applications / Shishkin R. A.,Erkhova N. A.,Beketov A. R.,Elagin A. A. // JOURNAL OF CERAMIC SCIENCE AND TECHNOLOGY. - 2014. - V. 5, l. 3. - P. 199-202.

ISSN/EISSN:

2190-9385 / нет данных

Type:

Article

Abstract:

Inorganic water-glass-based thermal pastes exhibit a higher thermal conductivity coefficient than silicon-based pastes. They can also be used at elevated temperatures. The optimum filler content, silicate modulus, application of a modifier and pressure were studied. As the result, a significant increase in the thermal conductivity at 508 degrees C could be explained. The MgO-Na2O-SiO2 system with high magnesium oxide content has not been studied adequately, so special attention is paid to this system composition.

Author keywords:

Water glass; silicate modulus; magnesium oxide; boron nitride; thermal conductivity; porosity; thermal paste; composite material CONDUCTIVITY

DOI:

10.4416/JCST2014-00005

Web of Science ID:

ISI:000347749000004

Соавторы в МНС:

Другие поля

Поле	Значение
Month	SEP
Publisher	GOLLER VERLAG GMBH
Address	ASCHMATTSTRASSE 8, D-76532 BADEN BADEN, GERMANY
Language	English
Keywords-Plus	CONDUCTIVITY
Research-Areas	Materials Science
Web-of-Science-Categories	Materials Science, Ceramics
Author-Email	r.shishkin@yahoo.com
ResearcherID-Numbers	Shishkin, Roman/N-1010-2013 Beketov, Askold/J-2509-2017
ORCID-Numbers	Shishkin, Roman/0000-0003-3232-7633
Number-of-Cited-References	9
Usage-Count-Last-180-days	3
Usage-Count-Since-2013	10
Journal-ISO	J. Ceram. Sci. Technol.
Doc-Delivery-Number	AY7OK