Planning Technology for Preparing High-Entropy Alloys (Solders) of the Cu-Ga-Pb-Sn-Bi System / Chikova O. A.,Tsepelev V. S.,V'yukhin V. V.,Shmakova K. Yu. // METALLURGIST. - 2015. - V. 59, l. 5-6. - P. 435-440.

ISSN/EISSN:

0026-0894 / 1573-8892

Type:

Article

Abstract:

Viscosity of alloy of the Cu-Ga-Pb-Sn-Bi system of equiatomic composition in a specimen heating regime followed by cooling is determined with the aim of planning technology for preparing ingots of high-entropy solders. Temperature and time dependences are studied for wetting angle and spot diameter of a steel St3 wetted surface under conditions of combined solder and substrate heating. Ingot and bimetal specimen microstructure obtained as a result of spreading tests is studied metallographically.

Author keywords:

melt; viscosity; wetting angle; spreading; structural state

DOI:

10.1007/s11015-015-0123-4

Web of Science ID:

ISI:000363268000015

Соавторы в МНС:

Другие поля

Поле	Значение
Month	SEP
Publisher	SPRINGER
Address	233 SPRING ST, NEW YORK, NY 10013 USA
Language	English
EISSN	1573-8892
Research-Areas	Metallurgy \& Metallurgical Engineering
Web-of-Science-Categories	Metallurgy \& Metallurgical Engineering
Author-Email	chik63@mail.ru v.s.tsepelev@urfu.ru
ResearcherID-Numbers	Vyukhin, Vladimir/T-4301-2017
Funding-Acknowledgement	Russian Federation {[}2014/236]
Funding-Text	The work was carried with support within the framework of scientific research of higher education establishments of the Russian Federation according to state assignment No. 2014/236.
Number-of-Cited-References	15
Usage-Count-Last-180-days	4
Usage-Count-Since-2013	36
Journal-ISO	Metallurgist
Doc-Delivery-Number	CU1GI